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12 W / MK Ultra Soft Thermal Gap Filler , Wireless Routers Heatsink Thermal Pad

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12 W / MK Ultra Soft Thermal Gap Filler , Wireless Routers Heatsink Thermal Pad

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Brand Name : ZIITEK

Model Number : TIF850HP

Certification : UL RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5work days

Packaging Details : 1000pcs/bag

Thermal conductivity : 12 W/mK

application : wireless router

Dielectric Breakdown Voltage : >5500 VAC

name : TIF850HP

feature : ultra soft

keywords : thermal gap filler pad

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12 W / MK Ultra Soft Thermal Gap Filler , Wireless Routers Heatsink Thermal Pad

The TIF850HP thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
Features:
> Good thermal conductive: 12 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies size
> Thickness: 1.25mmT
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

Typical Properties of TIF850HP
Color
Gray Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
*** 10mils / 0.254 mm

0.57

20mils / 0.508 mm

0.71

Hardness(Shore00 Thickness ≥0.75mm)

40

ASTM D297

30mils / 0.762 mm

0.88

40mils / 1.016 mm

0.96

Hardness(Shore00 Thickness <0.75mm)

65

ASTM C351

50mils / 1.270 mm

1.11

60mils / 1.524 mm

1.26

Density(g/cm3)
3.55 ASTM 2240

70mils / 1.778 mm

1.39

80mils / 2.032 mm

1.54

Thickness range

0.030''~0.200''

ASTM D412

90mils / 2.286 mm

1.66

100mils / 2.540 mm

1.78

Continuos Use Temp
-40 to 160℃

***

110mils / 2.794 mm

1.87

120mils / 3.048 mm

1.99

Dielectric Breakdown Voltage ≥5500 VAC ASTM D149

130mils / 3.302mm

2.12

140mils / 3.556 mm

2.22

Dielectric Constant
4.5 MHz ASTM D150

150mils / 3.810 mm

2.31

160mils / 4.064 mm

2.41

Volume Resistivity 1.0X1012
Ohm-meter
ASTM D257

170mils / 4.318 mm

2.51

180mils / 4.572 mm

2.58

Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

2.64

200mils / 5.080 mm

2.72

Thermal conductivity
12 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470

Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL

Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:

TIF™ series sheets type can add with fiberglass reinforced.
12 W / MK Ultra Soft Thermal Gap Filler , Wireless Routers Heatsink Thermal Pad

Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China

Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.


Product Tags:

thermally conductive filler

      

thermal conductivity silicone

      

Ultra Soft Thermal Gap Filler

      
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