New products die cutting in round shape thermal adhesive double side tape fire resistance equate 94 V-0
The TIA™605P Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.
Features
Thermal Conductivity: 0.8 W/mK
High bond strength to a variety of surfaces double sided pressure sensitive adhesive tape
High performance, thermally conductive acrylic adhesive
Fire rating equate 94 V0
Applications
Mount heat sink onto BGA graphic processor or drive processor
Mount heat spreader onto power converter PCB or onto motor control PCB
High performance, thermally conductive acrylic adhesive
Can be used instead of heat cure adhesive,screw mounting or clip mounting
| Typical Properties of TIATM605P Series | |
| Typical Properties | TIA605P | TEST WAY | |
| Color | White | VIEW | |
| Adhesive Type | Acrylic Adhesive | ********** | |
| Backing Type | PET | ********** | |
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| Continuous Use Temp | -45 °C to 120 °C | ********** | |
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| Thickness | 0.005" 0.127mm | ASTM D374 | |
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| Voltage Breakdown | > 1000 Vac | ASTM D149 | |
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| Thermal Conductivity | 0.8 W/mK | ASTM D5470 | |
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| 180°Peel Adhesion | > 1200 g/inch (Steel, Immediate) | PSTC-1 | |
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| 180°Peel Adhesion | > 1400 g/inch (Steel after 24 hrs) | PSTC-1 | |
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| Holding Power (25 °C/Hours) | > 48 Hours | PSTC-7 | |
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| Holding Power (80 °C/Hours) | > 48 Hours | PSTC-7 | |
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| Fire rating | equate 94 V0 | ***** |
Standard Thicknesses:
0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm)
Consult the factory alternate thickness.
Standard Sizes:
40" x 100'(1016mm x 30.48M) Individual die cut shapes can be supplied.
Reinforcement:
TIA™600P series The coil can be filled with PET.
Product Tags:
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Die Cutting Round Shape Thermal Adhesive Tape Double Sided White Images
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